... has accumulated a wide experience in semiconductor power device assembly.
In view of the need for high temperature, high reliability die attach technologies to fulfil the increasing demands of silicon and wide bandgap devices, we have developed a nanosilver based solder paste offering an excellent performance for Ti-Ni-Ag or Au backed power chips on Cu DBC substrates or frames.
Also, to optimize the sintering process needed to achieve the required mechanical, thermal and electrical characteristics of the joint, we have developed a suitable sintering furnace that can provide the best final results with just the pressing of a button. The furnace is equipped with an internal pump that provides vaccum to help with solvent removal and minimize substrate oxidation as well as pressure to improve densification and adherence during sintering. No external supply except for mains power is required, with the consequent simplicity of use.
Both the solder paste and sintering furnace constitute a self standing die attach turn key process providing the required high temperature, high reliability and good repetability joint for silicon and wide bandgap power devices for most demanding applications.